PRODESO HEAT GRIP MEMBRANE

地暖墊

防水  抗裂

具有抗裂抗分離喬接，防水和排氣管理功能的聚乙烯膜，厚度為8.5MM，背面為熱焊接非織造布，可確保與基材黏合。
新型地暖墊結構可完美固定加熱電纜，並具有比PRODESO®HEAT (上一代) 高5倍的抗裂橋接能力。

U.S. Patent No. 8,176,694;
U.S. Patent No. 9,188,348;
U.S. Patent No. 9,416,979;
U.S. Patent No. 9,518,746;
U.S. Patent No. 9,719,265;
U.S. Patent No. 9,726,383;
U.S. Patent No. 9,777,931;
U.S. Patent No. 10,006,644;
U.S. Patent No. 10,502,434;
U.S. Patent No. D816,617;
U.S. Patent No. D872,901;
and Patents Pending.